In this case does packaging mean packaging the silicon die to a processor or soc that can then be used? Or does it mean the assembly of the end product, such as a phone or laptop?
In either case it seems like a moot point to complain that this is a major issue for the long term. Shouldn’t assembly lines for said stuff should be much easier to build in comparison to a chip fab?
Also the fact that the Arizona fab only produces a small fraction of TSMC’s total output is kind of obvious. There are a lot of chip fabs, so US encouragement for domestic production has to be an ongoing effort.